Product Features and Benefits





From a business perspective, wafer dicing is the final step in wafer processing where the total cost per wafer is at the highest. It is imperative to place the best equipment for wafer dicing such that the value per die is preserved and the operational step is not a bottleneck for delivering products to your customers. In the following, we will discuss a few typical process challenges and value- added solutions that MPT’s system provides. You are welcome to benchmark and discover how much cost saving and how many improvements in quality and productivity can be realized with MPT’s wafer dicing system.
Specifications



 Challenge 1: Defect losses (Quality issues)

Depending on wafer’s device application, dicing equipment, and dicing method used, common defects introduced at the wafer dicing step are chipout, wafer crack, die crack, particulate contamination, rough edge, poor adhesion, damaged devices and thermal induced failures.

Solution:

MPT’s system is designed with preventive measures in mind to minimize defect generation.
  • Patented scribe force feedback control system measures the force to a precision of 1/10th of a gram and controls the scribe force to within a few percent of the set point by sampling and correcting the force 4000 times per second to ensure consistent scribe depth across the entire wafer.
    Benefit includes:
    • Eliminate scribe inconsistency that often leads to chipout, die crack, or rough edge.
  • Patented breaking technique to eliminate die edge contacts during die separation.
    Benefits include:
    • Eliminate chipout
    • Ensure breaking precision
  • Solid porous ceramic vacuum chuck to secure the wafer during scribe and break.
    Benefits include:
    • Ensure precise position control
    • Ensure wafer integrity without crack
    • Eliminate problems associated with tape and wafer movement
  • No D.I. water jet nor front side mechanical contact or impact.
    Benefits include:
    • No particulate contamination (critical for devices such as silicon image sensors and detectors)
    • No adhesion defect due to water jet agitation
    • No thermal induced defect
    • Clean and damage-free wafer (critical for devices such as mechanical MEMS)
  • Scribe tip is lowered to wafer surface inside the edge and force is stabilized and precisely controlled across the entire length of scribe motion.
    Benefit includes:
    • Eliminate wafer edge damage or crack
  • Scribe and break to produce optically flat edge surface.
    Benefit includes:
    • High device yield (critical for devices such as laser diodes and optical devices)
Specifications




 Challenge 2: Downtime losses (Availability issues)

Downtime losses include preventive maintenance, equipment failure, engineering set-up, process qualification, or lack of operator coverage. These losses disrupt wafer process flow and strain resources in engineering, maintenance, and production.

Solution:

These losses are minimized by MPT’s engineering innovations in equipment design.
  • Digital force sensors and air bearing stages for motion control to eliminate the need of cleaning, lubrication, or manual adjustment.
    Benefit includes:
    • No preventive maintenance is required
  • Patented scribe tools to present continuous cutting angles.
    Benefit includes:
    • Longer tool life and less downtime
  • Remote diagnostics over virtual private network.
    Benefits include:
    • Online diagnostics for fast response time
    • No wait for field service
    • In case of equipment failure, replacement parts or modules can be shipped overnight to minimize system downtime
  • First dicing system to provide data for real-time feedback and statistical process control.
    Benefit includes:
    • Shorter engineering time to develop and characterize process
  • Highly integrated system automation and precision control.
    Benefits include:
    • Shorter training time
    • Fewer operators are required
    • Less operator time is required
    • Minimize operator intervention (cassette-to-cassette operation is optional)
Specifications

 Challenge 3: Throughput losses (Performance issues)

Throughput is defined as the quantity out per equipment per unit time. There are two general limitations to throughput that are dicing equipment dependent. They are die per wafer and wafer per equipment per unit time.

Solution:

The throughput of MPT’s system outperforms other dicing equipment available in the market.
  • Automated wafer load and alignment to take less than 30 sec.
    Benefit includes:
    • Short set-up time
  • Bi-directional scribe.
    Benefit includes:
    • Save the scribe tip travel time by 2X
  • High magnification motorized microscope and precision 0.1-micron encoders on all stages to allow more precise placement of the scribe tip.
    Benefits include:
    • Narrower street
    • More dice per wafer
  • Scribe motion up to 1000 mm/sec.
    Benefits include:
    • Faster scribe speed
    • More wafers out per hour
  • Separate scriber and breaker systems.
    Benefits include:
    • No loss of scribe time
    • More flexible for capacity ramp planning
 
 
 
 
1